Content: Unit processes in the manufacture of integrated circuits / Pieter Stroeve —
Conservation laws for mass, momentum, and energy : application to semiconductor devices and technology / Bill Baerg —
Silicon oxidation : a process step for the manufacture of integrated circuits / Eugene A. Irene —
Convective diffusion in zone refining of low Prandtl number liquid metals and semiconductors / William N. Gill, Nicholas D. Kazarinoff, and John D. Verhoeven —
Research opportunities in resist technology / David S. Soong —
Physical and chemical modifications of photoresists / Peter C. Sukanek —
Effects of developer concentration on linewidth control in positive photoresists / Tom Batchelder —
The advantage of molecular-beam epitaxy for device applications / A.Y. Cho —
Chemical and physical processing of ion-implanted integrated circuits / Joseph C. Plunkett —
Plasma-assisted processing : the etching of polysilicon in a diatomic chlorine discharge / Herbert H. Sawin, Albert D. Richards, and Brian E. Thompson —
Applications of oxides and nitrides of germanium for semiconductor devices / O.J. Gregory and E.E. Crisman —
Vapor-phase epitaxy of Group III-V compound optoelectronic devices / G.H. Olsen —
Advanced device isolation for very large scale integration / H.B. Pogge —
Solid-liquid equilibrium in ternary Group III-V semiconductor materials / T.L. Aselage, K.M. Chang, and T.J. Anderson : preparation of device-quality strained-layer superlattices / R.M. Biefeld —
Wafer design and characterization for integrated-circuit processes / R. Schindler, D. Huber, and J. Reffle.
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